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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2015152854
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of suppressing an etching residue or a plating deposition defect.SOLUTION: The photosensitive resin composition comprises: (A) an alkali-soluble polymer; (B) a compound having an ethylenically unsaturated double bond; and (C) a photopolymerization initiator. The photosensitive resin composition has such a property that, when the photosensitive resin composition is laminated on a copper substrate, heated at 60°C, and developed for a time period which is 1.2 times as long as the minimum development time, it takes 7 hours or more of heating to generate a development residue.

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Inventors:
KOSAKA JUNYA
OCHIAI MASAHIKO
Application Number:
JP2014028651A
Publication Date:
August 24, 2015
Filing Date:
February 18, 2014
Export Citation:
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Assignee:
ASAHI KASEI E MATERIALS CORP
International Classes:
G03F7/004; G03F7/031; H01L21/027; H05K3/28
Domestic Patent References:
JP2008058636A2008-03-13
JP2008003558A2008-01-10
JP2009185181A2009-08-20
JP2014010333A2014-01-20
JP2012203165A2012-10-22
JP2014010330A2014-01-20
JPH08272095A1996-10-18
JP2013011665A2013-01-17
JP2010237570A2010-10-21
JP2009198966A2009-09-03
JP2006153984A2006-06-15
JP2004244610A2004-09-02
JP2002256062A2002-09-11
JPH0528827A1993-02-05
JPH10333331A1998-12-18
JP2013061556A2013-04-04
JP2013117581A2013-06-13
Foreign References:
WO2012086371A12012-06-28
WO2006057423A22006-06-01
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima



 
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