PHOTOSENSITIVE RESIN COMPOSITION AND WIRING CIRCUIT BOARD OBTAINED BY USING THE SAME

Title:

PHOTOSENSITIVE RESIN COMPOSITION AND WIRING CIRCUIT BOARD OBTAINED BY USING THE SAME

Document Type and Number:

Japanese Patent JP2007328049

Kind Code:

A

Abstract:

To provide a photosensitive resin composition excellent in suitability to plating uniformity, bending resistance, low stress property and resistance to the heat of soldering and also having good insulation, and a wiring circuit board obtained by using the same.

The photosensitive resin composition comprises (A) a carboxyl group-containing linear polymer, (B) an ethylenically unsaturated group-containing polymerizable compound, (C) a photopolymerization initiator, (D) a heterocyclic mercaptan compound represented by general formula (1) and (E) a tetrazole compound.

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Inventors:

MIZUTANI MASANORI

Application Number:

JP2006157757A

Publication Date:

December 20, 2007

Filing Date:

June 06, 2006

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

G03F7/004; C08F2/44; C08F299/02; C08G59/24; C08G59/42; G03F7/027; G03F7/033; H05K1/03

Domestic Patent References:

JP2004156024A	2004-06-03
JPS616646A	1986-01-13
JPH07271027A	1995-10-20
JPH1172915A	1999-03-16
JPH0572733A	1993-03-26

Attorney, Agent or Firm:

Masahiko Nishito
Iisaki Aika
Yuko Saito

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