Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP4694130
Kind Code:
B2
Abstract:
The plasma processing apparatus includes: a processing container 11 having a holding stage 13 that holds a substrate 12 to be processed; a micro-wave transmission window 17 provided on or above the processing container, opposite to the substrate to be processed placed on the holding stage; a micro-wave antenna 20 provided above the processing container correspondingly to the micro-wave transmission window for supplying a micro-wave into the processing container; and a micro-wave electric power supplying source 32 connected to the micro-wave antenna. The plasma processing apparatus further includes an electric-field measuring unit 25, 26 that measures electric field strength of the micro-wave supplied by the micro-wave antenna, and a controlling unit 32 a, 50 A that controls the micro-wave electric power supplying source based on the electric field strength measured by the electric-field measuring unit. This enables a stable substrate process.
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Inventors:
Koji Kotani
Application Number:
JP2004010978A
Publication Date:
June 08, 2011
Filing Date:
January 19, 2004
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/31; C23C16/44; C23F4/00; H01J37/32; H01L21/304; H05H1/00; H05H1/46
Domestic Patent References:
| JP2001203097A | ||||
| JP11044720A | ||||
| JP6349594A |
Foreign References:
| WO1998033362A1 | ||||
| US5568801 | ||||
| US5506475 |
Attorney, Agent or Firm:
Tadahiko Ito