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Title:
POLISHING SOLUTION FOR METALS, AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
Japanese Patent JP2009094504
Kind Code:
A
Abstract:

To provide a polishing solution for metals, which can compatibly accelerate a polishing speed and lower dishing when polishing a body to be polished (wafer), and to provide a chemical mechanical polishing method using the polishing solution.

The polishing solution for metals is used for the chemical mechanical polishing in a semiconductor device manufacturing process, and contains a compound expressed by general formula: (X1)n-L (in the general formula (1), wherein X1 represents a heterocycle including at least one nitrogen atom, n represents an integer of 2, and L represents a bonding group of bivalent or more, and n pieces of X1 may be respectively same or different), an oxidant, and organic acid.


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Inventors:
YOSHIKAWA SUSUMU
INABA TADASHI
INADA HIROSHI
TOMIGA TAKAMITSU
Application Number:
JP2008243245A
Publication Date:
April 30, 2009
Filing Date:
September 22, 2008
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
JPS60237077A1985-11-25
JP2008235714A2008-10-02
JP2006049790A2006-02-16
JP2007088284A2007-04-05
JP2007088024A2007-04-05
JP2007081316A2007-03-29
JP2007208220A2007-08-16
JP2007235005A2007-09-13
JP2006269909A2006-10-05
JP2006113175A2006-04-27
JP2006096875A2006-04-13
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa



 
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