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Patent Searching and Data


Title:
POLISHING TOOL SUITABLE FOR PAD CONDITIONING AND POLISHING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2012121129
Kind Code:
A
Abstract:

To provide a tool for use in conditioning, which is easy to control processes and also can improve a service life of the tool.

The polishing tool includes a rigid substrate having a planar circular surface, on which a group of cutting edges 31 with a flat top face of a limited area positioned within a certain level for the circular surface are arranged in a grid state comprising two intersecting sets of parallel lines 41 and 42. Each cutting edge 31 is made of sintered diamond having a rectangular cross section (horizontal cross section) vertical to an axis of the tool on the top and also having a longitudinal ridge extending in the axial direction. The cutting edge 31 is formed in a plurality of polishing islands with an area limited as a group. The polishing tool includes the plurality of polishing islands which are regularly disposed on concentric circles with respect to the rotation center of the tool at a constant spacing, and is suitable for dressing a CMP pad.


Inventors:
ISHIZUKA HIROSHI
Application Number:
JP2011008751A
Publication Date:
June 28, 2012
Filing Date:
January 19, 2011
Export Citation:
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Assignee:
SHINGIJUTSU KAIHATSU KK
International Classes:
B24B53/12; B24D3/00; B24D7/06