POLYESTER RESIN, POLYESTER RESIN COMPOSITION COMPRISING THE SAME AND POLYESTER MOLDING

Title:

POLYESTER RESIN, POLYESTER RESIN COMPOSITION COMPRISING THE SAME AND POLYESTER MOLDING

Document Type and Number:

Japanese Patent JP2005220234

Kind Code:

A

Abstract:

To provide a polyester resin usable to solve the problems the prior art raises, such as generation of acetaldehyde and a cyclic trimer at the time of molding; to provide a polyester resin composition capable of efficiently producing a hollow molding excellent in transparency and flavor preservability, not having problems such as deterioration of the transparency due to the die soiling at the time of continuous molding and also excellent in dimensional stability against heat; and to provide a molding consisting thereof.

The polyester resin is mainly composed of an aromatic dicarboxylic acid component and ethylene glycol component; it is copolymerized or formulated with a phosphorous compound in an amount of 100-5,000 ppm as phosphorus atom; and its acetaldehyde content is ≤150 ppm.

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Inventors:

HARA ATSUSHI
TOGAWA KEIICHIRO
MATSUI YOSHINAO
NAKAJIMA TAKAHIRO
UOTANI KOSUKE
WATANABE NAOKI

Application Number:

JP2004030002A

Publication Date:

August 18, 2005

Filing Date:

February 05, 2004

Export Citation:

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Assignee:

TOYO BOSEKI

International Classes:

B65D1/00; B65D1/09; B65D65/02; C08G63/692; C08K5/49; C08L67/02; (IPC1-7): C08G63/692; B65D1/09; B65D65/02; C08K5/49; C08L67/02

Domestic Patent References:

JPH10316765A	1998-12-02
JP2000119384A	2000-04-25
JP2005170483A	2005-06-30
JP2001081173A	2001-03-27

Foreign References:

WO2003102079A1

2003-12-11

Attorney, Agent or Firm:

Norio Kakizawa

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