POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION, INTERLAYER INSULATING FILM AND METHOD FOR FORMING THE SAME

Title:

POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION, INTERLAYER INSULATING FILM AND METHOD FOR FORMING THE SAME

Document Type and Number:

Japanese Patent JP2011191344

Kind Code:

A

Abstract:

To provide a positive radiation-sensitive resin composition which has good alkali developability, can be cured by low-temperature heating, and also has high radiation sensitivity.

The positive radiation-sensitive resin composition includes a polymer having at least one structural unit selected from polyvinyl ethers in which tertiary carbon has an oxetanyl structure and an acid generator. It is preferable that the polymer further includes a maleic anhydride or maleimide structural unit as a monomer unit.

More Like This:

JP3915650	IMAGE FORMING MATERIAL HAVING BLUE-VIOLET LASER PHOTOSENSITIVE RESIST MATERIAL LAYER AND METHOD FOR FORMING RESIST IMAGE
JP6427684	A resist composition, and a resist film, a pattern forming method, and an electronic device manufacturing method using the resist composition.
JP5308876	Positive resist composition, resist pattern forming method

Inventors:

YONEDA EIJI
KAJITA TORU

Application Number:

JP2010055156A

Publication Date:

September 29, 2011

Filing Date:

March 11, 2010

Export Citation:

Click for automatic bibliography generation Help

Assignee:

JSR CORP

International Classes:

G03F7/039; C08F216/12; C08F220/06; C08F220/28; C08F222/06; C08F222/40; G03F7/004; G03F7/40; H01L21/027

Attorney, Agent or Firm:

Hajime Amano
Fujimoto Katsune
Fujii Kosuke
Yoshinori Ikeda
Satoru Miyazaki
Hiroshi Ogawa
Sanae Kato
Yu Okutani

Previous Patent: DISPLAY SHEET, DISPLAY DEVICE AND ELECTRONIC APPARATUS

Next Patent: FIXING DEVICE, FIXING HEATER AND IMAGE FORMING APPARATUS