To reliably inspect a plurality of chips simultaneously by arranging the tips of probe elements in each probe region in a straight line to match each region with the chip and pressing the tips of the probe elements against the electrodes of corresponding chips.
The probe region 30 of a probe unit 12 comprises four of probe element groups 32 corresponding to the electrodes groups of chips at each side of a rectangular, and each probe element group 32 comprises a plurality of probe elements 34 each including one end of a wire 26. In the probe elements 34, protrusion electrodes 38 at their tips are arranged in a straight line for every probe element group 32. When the protrusion electrodes 38 are pressed by the electrodes of chips at the time of inspecting a semiconductor wafer, the probe elements 34 are slightly curved, and the protrusion electrodes 38 are slid to the electrodes of the chips to trim away oxide films on the surfaces of the electrodes of the chips. Therefore, the protrusion electrodes 38 come into reliable contact with the electrodes of the chips. In a probe card 10, it is possible to obtain satisfactory electric contact between the protrusion electrodes 38 and the electrodes of the chips.
TANABE ISAO
SHIRAI KAZUO
KIYOFUJI HIDEHIRO
URAKAWA YOICHI
AKAHIRA AKIHISA
