Title:
RESIN FILLING DEVICE
Document Type and Number:
Japanese Patent JP2004079584
Kind Code:
A
Abstract:
To provide a resin filling device simplified in device structure, not high in manufacturing cost, and excellent in productivity.
A sliding body 12 that slides on the surface of a printed wiring board 40 is provided with an air suction aperture 13a connected to an evacuation unit 20 and with a resin feed aperture 14a accommodating a resin. A via-hole 41 is connected to the air suction aperture 13a for evacuation for production of a vacuum therein, and then is connected to the resin feed aperture 14a for filling a resin R. Since what is required is the production of a vacuum only in the via-hole 41, time for evacuation is shortened greatly.
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Inventors:
OGAWA HIROYOSHI
HATTORI ATSUNORI
YAZAKI YOSHITARO
HATTORI ATSUNORI
YAZAKI YOSHITARO
Application Number:
JP2002233948A
Publication Date:
March 11, 2004
Filing Date:
August 09, 2002
Export Citation:
Assignee:
NODA SCREEN KK
DENSO CORP
DENSO CORP
International Classes:
B05C5/00; H05K3/28; (IPC1-7): H05K3/28; B05C5/00
Attorney, Agent or Firm:
Arisa Ushiro
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