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Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011038780
Kind Code:
A
Abstract:

To provide a semiconductor device including a movable part and a method of manufacturing the same capable of precisely positioning a substrate and a lid.

The semiconductor device includes: the substrate 10 having on a surface thereof a first movable part 21 and a second movable part 22 made of semiconductor at least on whose upper surface and side surface an insulating film deformed by external force is formed; and the lid 80 made of an insulating film having a sealed through-hole 81 and disposed above the substrate 10 so that a space 300 is formed between the first movable part 21 and the second movable part 22.


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Inventors:
FUJITA YUSHIN
NISHIKAGE HARUHIKO
KAWACHI HIRONOBU
Application Number:
JP2009183450A
Publication Date:
February 24, 2011
Filing Date:
August 06, 2009
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
G01P15/08; B81B3/00; B81C1/00; G01P15/125; H01L29/84
Attorney, Agent or Firm:
Hidekazu Miyoshi
Keishin Terayama
Hiroyuki Miyoshi
Ichitaro Ito



 
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