PURPOSE: To carry out a testing at high precision by conveying a semiconductor by a conveying rail, putting the semiconductor on a contact guide in which a plurality of wedge-like recessed parts extended at right angles to the conveying direction are formed while lead terminals of the semiconductor being brought into contact with the guide, and carrying out a testing while the lead terminals and pins for testing being brought into contact with each other.

CONSTITUTION: A plurality of wedge-like recessed parts 2 extended at right angles to the conveying direction of a semiconductor device 7 are formed in a contact guide 1 and a stopper 3 to stop the device 7 is installed at an end part. The device 7 moves due to the self-weight on a tilting conveying rail 4 toward the guide 1 and is stopped by the stopper 3 and then mounted on the guide 1 while the lead terminals being brought into contact with the guide 1. The lead terminals are brought into contact with pins 6 for testing of a contact 5 in an upper part by elevating the guide 1. At the time when the apparatus 7 is conveyed, a coating material peeled out of the lead terminals is stored in the recessed parts 2. As a result, the possibility of the short circuit occurrence between lead terminals is lessened and precise testing can be carried out.