Title:
半導体装置
Document Type and Number:
Japanese Patent JP6575220
Kind Code:
B2
Abstract:
Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.
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Inventors:
Yuji Takematsu
Kenji Okamoto
Kenji Okamoto
Application Number:
JP2015161170A
Publication Date:
September 18, 2019
Filing Date:
August 18, 2015
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/29; C08L101/00; C09J133/04; C09J163/00; C09J175/04; C09J179/04; C09J183/04; C09J201/00; H01L23/31
Domestic Patent References:
| JP2014090016A | ||||
| JP2011011164A | ||||
| JP2008540733A | ||||
| JP2003031063A | ||||
| JP2006179538A |
Foreign References:
| WO2012137338A1 | ||||
| US20040007784 | ||||
| US20070029653 | ||||
| US20110156234 |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Ayako Nakamura
Satoshi Morimoto
Yu Tanaka
Tokumoto Koichi
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Ayako Nakamura
Satoshi Morimoto
Yu Tanaka
Tokumoto Koichi