Title:
SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3687254
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sealed type semiconductor laser device which can emit a laser beam in parallel with the normal to a reference plane and a method for manufacturing the laser device.
SOLUTION: A semiconductor laser device is constituted in such a way that a laser diode (LD) chip 1 stuck to a main plate 5b integrally formed with a main post through a sub-mount 3 is covered with an end-face breakage preventing layer 10 and sealed with a resin 9 and the end section of the main plate 5b is stuck to the groove section of a base ring 40 having a reference plane the Z-axis of which is made coincident with the normal to the plane, and then, the optical axis ζ of a laser beam emitted from the LD chip 1 is made coincident with that of the chip 1 and the passing areas of the optical axis of the laser beam at the interface between the layer 10 and resin 9 and at the interface face between the resin 9 and air are respectively set at first and second interfaces. The optical axis of the laser beam emitted to the air from the second interface is made parallel to the z-axis by inclining at least the optical axis of the chip 1, the normal to the first or second interface, or the direction of the groove section from the Z-axis.
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Inventors:
Shinji Ogino
Hiromi Sogawa
Youichi Shindo
Hiromi Sogawa
Youichi Shindo
Application Number:
JP5808497A
Publication Date:
August 24, 2005
Filing Date:
March 12, 1997
Export Citation:
Assignee:
Fuji Electric Holdings Co., Ltd.
International Classes:
H01S5/00; H01S5/022; H01S5/16; (IPC1-7): H01S5/16; H01S5/022
Domestic Patent References:
| JP4048673A | ||||
| JP4048675A | ||||
| JP5129731A | ||||
| JP62076554U |
Attorney, Agent or Firm:
Masaharu Shinobe