Title:
SEMICONDUCTOR PRESSURE SENSOR AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3131370
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce the cost by sharing the bonding method and the components between a chip and the body part.
SOLUTION: A chip 4 (pressure-sensitive chip 2, glass base 3) and a pressure introduction pipe 5 are previously bonded at a first bonding part 7 to constitute a bonded body 6 of pipe and pressure introduction pipe. The bonded body 6 is employed as a basic component and bonded to the body part 10 provided with the signal take-out part 9 of pressure-sensitive chip 2 at a second bonding part 8.
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Inventors:
Koichi Yoshioka
Norio Yoshida
Norio Yoshida
Application Number:
JP33634195A
Publication Date:
January 31, 2001
Filing Date:
December 25, 1995
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
G01L9/04; G01L19/00; (IPC1-7): G01L9/04
Domestic Patent References:
| JP7103841A | ||||
| JP6463832A | ||||
| JP4320938A | ||||
| JP6461636A | ||||
| JP337536A | ||||
| JP6273248A | ||||
| JP7103841A | ||||
| JP9126923A | ||||
| JP5754036U | ||||
| JP5737259U | ||||
| JP687839U |
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)