To provide a dynamic amount sensor in which no output change occurs due to temperature change.

A plurality of protrusions 10b are formed on the inner bottom 10a of a resinous package 10, and a sensor chip 12 is disposed at the ends of the protrusions 10b. A space 15 is formed between the bottom 10a of the package 10 and the chip 12. Die bonding material 11 easy to change the shape by elastic force is charged in the space 15 to adhere the package 10 to the chip 12. Since the chip 12 is brought into contact with only the protrusions 10b, even if the package 10 is thermally expanded due to the different ambient temperature, the stress to be transmitted to the chip 12 is very small. Further, since the material 11 is deformed to absorb the stress, the chip 12 is not deformed, and the output of the sensor can be held constant.