SEMICONDUCTOR WAFER TRANSFER JIG - MITSUBISHI MATERIAL SILICON

Title:

SEMICONDUCTOR WAFER TRANSFER JIG

Document Type and Number:

Japanese Patent JPH0794574

Kind Code:

A

Abstract:

PURPOSE: To realize quick transfer work of wafer without causing any damage thereon when a wafer is transferred from one cassette storing a plurality of semiconductor wafers to another cassette or the like.

CONSTITUTION: When semiconductor wafers W stored in a wafer cassette 2 at a constant pitch are transferred to an etching magazine 3 at a different pitch, the frame body 11 of a transferring jig is fixed to the opening 6 of wafer cassette storing wafers and then a slider is slid with respect to the frame body thus passing the wafers through a plurality of openings made through the slider.

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Inventors:

ITO KENICHI
SATO KAZUNORI
ITO KAZUMI
KUSAKABE NAOTO

Application Number:

JP23851993A

Publication Date:

April 07, 1995

Filing Date:

September 24, 1993

Export Citation:

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Assignee:

MITSUBISHI MATERIAL SILICON
MITSUBISHI MATERIALS CORP

International Classes:

B65G49/07; H01L21/67; H01L21/68; (IPC1-7): H01L21/68; B65G49/07

Attorney, Agent or Firm:

Takahisa Sato (2 outside)

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