Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023045349
Kind Code:
A
Abstract:
To sufficiently remove relatively small objects to be removed on a substrate.SOLUTION: A substrate processing device (100) comprises: a substrate holding and rotating mechanism (120) that holds a substrate (W) horizontally and rotates the substrate (W); a magnetic fluid supply part (130) that supplies magnetic fluid to the substrate (W) held by the substrate holding and rotating mechanism (120); a magnetic force application part (150) that applies a magnetic force to the magnetic fluid supplied to the substrate (W); a rinse liquid supply part (140) that supplies rinse liquid to the substrate (W) to remove the magnetic fluid supplied to the substrate (W); and a control part (112) that controls the substrate holding and rotating mechanism (120), the magnetic fluid supply part (130), the magnetic force application part (150) and the rinse liquid supply part (140).SELECTED DRAWING: Figure 2
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Inventors:
TANAKA TAKAYOSHI
Application Number:
JP2021153699A
Publication Date:
April 03, 2023
Filing Date:
September 22, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/304
Attorney, Agent or Firm:
Hiroyuki Maei