TINNED STRIP OF Cu-Sn-P-BASED ALLOY

Title:

TINNED STRIP OF Cu-Sn-P-BASED ALLOY

Document Type and Number:

Japanese Patent JP2007291459

Kind Code:

A

Abstract:

To provide a tinned strip of Cu-Sn-P-based alloy, in which the thermal peeling resistance of a tin plating is improved.

In the tinned strip of Cu-Sn-P-based alloy comprising, as a base material, a Cu-based alloy containing Sn in an amount of 1-12 mass% and P in an amount of 0.01-0.35 mass%, the C-concentration in the boundary face between a plated layer and the base material is adjusted to be ≤0.10 mass%. The base material may further contain 0.005-3.0 mass% in total of at least one kind selected from the group comprising Zn, Fe, Ni, Si, Mn, Co, Ti, Cr, Zr, Al and Ag.

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Inventors:

HATANO TAKATSUGU

Application Number:

JP2006121850A

Publication Date:

November 08, 2007

Filing Date:

April 26, 2006

Export Citation:

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Assignee:

NIKKO KINZOKU KK

International Classes:

C25D7/06; B21B1/22; C22C9/02; C25D5/12

Domestic Patent References:

JPH04354894A	1992-12-09
JPH04180589A	1992-06-26
JPH09320668A	1997-12-12
JP2005226097A	2005-08-25

Attorney, Agent or Firm:

Motohiro Kurauchi
Endo Azusa
Takumi Yoshida
Taku Nakajima

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