Title:
THERMAL CONDUCTION SHEET AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3936134
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal conduction sheet which can sufficiently prevent the peeling of an adhesive face and delamination of constituent elements themselves, has a high lamination maintaining strength, hardly has defects such as cleaving with respect to the deformation, and has an excellent mass productivity, needless to say a good thermal conductivity.
SOLUTION: A sheet-like elastomer layer 2 is laminated on one face of a sheet-like graphite layer 1. The sheet-like graphite layer 1 is formed with many through holes in the thickness direction. Many elastomer projections 4 projecting from the sheet-like elastomer layer 2 are set in the through holes 3 to construct the thermal conduction sheet.
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Inventors:
Nakanishi Mikiiku
Application Number:
JP2000340460A
Publication Date:
June 27, 2007
Filing Date:
November 08, 2000
Export Citation:
Assignee:
Taika Co., Ltd.
International Classes:
B32B3/24; H01L23/36; B32B3/30; B32B9/00; H01L23/373; (IPC1-7): H01L23/36; B32B3/24; B32B3/30; B32B9/00; H01L23/373
Domestic Patent References:
| JP11026662A | ||||
| JP10107190A | ||||
| JP9162336A | ||||
| JP9219113A | ||||
| JP2000063670A | ||||
| JP2002038033A | ||||
| JP2002009213A | ||||
| JP3847022B2 |
Attorney, Agent or Firm:
Yoshiharu Yoshida
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