Title:
THERMAL HEAD
Document Type and Number:
Japanese Patent JP3405724
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal head which can be connected easily with a set by miniaturization.
SOLUTION: This device comprises a first ground electrode 15 provided along the longitudinal direction of an insulated substrate 1 on an insulated film 21 provided on an individual electrode 8 lead out from a heat generating resistor 6, a second ground electrode 18 connected with a driving IC, provided along the longitudinal direction of the insulated substrate on the side opposite to the first ground electrode with respect to the driving IC 9, and a connection electrode 22 for electrically connecting the first ground electrode and the second ground electrode, disposed across the adjacent driving ICs.
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Inventors:
Iwata et al.
Hiroki Kubo
Koji Oyane
Norio Yamaji
Hiroki Kubo
Koji Oyane
Norio Yamaji
Application Number:
JP2001015905A
Publication Date:
May 12, 2003
Filing Date:
October 18, 1996
Export Citation:
Assignee:
Aoi Electronics Co., Ltd.
International Classes:
B41J2/345; B41J2/335; (IPC1-7): B41J2/345; B41J2/335
Domestic Patent References:
| JP7276691A | ||||
| JP8125335A | ||||
| JP627568A | ||||
| JP6171133A | ||||
| JP63216760A | ||||
| JP6297745A | ||||
| JP878626A |
Attorney, Agent or Firm:
Takashi Shibuya
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