Title:
【発明の名称】ダイシングソーのためのモニタリングシステム
Document Type and Number:
Japanese Patent JP2003516624
Kind Code:
A
Abstract:
A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.
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Inventors:
Weishaus, Iran
Ricto, Oded Yehoshua
Ricto, Oded Yehoshua
Application Number:
JP2001543289A
Publication Date:
May 13, 2003
Filing Date:
November 30, 2000
Export Citation:
Assignee:
Coolic and Sofa Investments, Inc.
International Classes:
H01L21/301; B23D5/02; B23D59/00; B23Q15/08; B23Q15/12; B28D5/00; G05B19/4065; H01L21/00; (IPC1-7): H01L21/301
Attorney, Agent or Firm:
Shusaku Yamamoto