Title:
【発明の名称】ダイオード配列チップの製作中のダイオード配列チップの分離
Document Type and Number:
Japanese Patent JPH04503284
Kind Code:
A
Abstract:
Rather than being separated along a single cleavage line between their adjacent ends, diode arrays are spaced apart on a fabrication wafer to allow parallel cleavage lines to be established between the ends of each adjacent pair of arrays by scribed grooves located along opposite sides of a narrow disposable strip of wafer material. A cleaving technique substantially insures that any projecting lip along the cleavage plane will be on the disposable strip rather than on a diode chip, so that such a defect cannot interfere with proper end-to-end spacing of the chips when they are subsequently assembled to provide a continuous row of chips with uniformly spaced individual light-emitting sites.
More Like This:
Inventors:
McCrag, Scott Douglas
Application Number:
JP50081490A
Publication Date:
June 11, 1992
Filing Date:
November 14, 1990
Export Citation:
Assignee:
Eastman Kodak Company
International Classes:
H01L21/301; H01L21/304; H01L27/15; H01L33/00; (IPC1-7): H01L33/00
Attorney, Agent or Firm:
Kyozo Yuasa (6 people outside)