Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS5989319
Kind Code:
A
Abstract:
PURPOSE: The titled inexpensive composition useful as a binder for heat insulating material of riser, refractory, etc., having improved setting properties, obtained by dissolving a catechol resin in a phenol and an aldehyde, reacting them under acidic or alkaline conditions.
CONSTITUTION: A catechol resin is dissolved in a phenol such as phenol, cresol, etc. and an aldehyde such as formalin, and reacted under acidic or alkaline conditions, to give the desired resin composition.
USE: A binder for whetstone, castings, foamed material, plywood, laminate, etc.
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Inventors:
ONOZAWA FUJIO
MORITA SEIJI
ISHISONE KAZUMI
NISHIZAWA HIDEAKI
MORITA SEIJI
ISHISONE KAZUMI
NISHIZAWA HIDEAKI
Application Number:
JP19678782A
Publication Date:
May 23, 1984
Filing Date:
November 11, 1982
Export Citation:
Assignee:
GUNEI KAGAKU KOGYO KK
International Classes:
C08G8/00; C08G8/20; C08G8/24; (IPC1-7): C08G8/24
Attorney, Agent or Firm:
Hirasawa Hidee
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