Title:
TRANSFER MECHANISM
Document Type and Number:
Japanese Patent JP2019133979
Kind Code:
A
Abstract:
To ensure that a holding claw enters between the lower surface of a wafer and a holding surface in a transport mechanism that holds the outer periphery of the wafer by causing the holding claw to enter between the lower surface of the wafer and the holding surface.SOLUTION: Air is ejected from an air nozzle 8 to float a plate-like workpiece W from the holding surface of a holding table 9, and a guide column 6 is brought into contact with the outer peripheral edge Wd of the plate-like workpiece W by moving a movable support portion 4 toward the center of the plate-like workpiece W by advancing and retreating means 5, the movable support portion 4 is moved in the same direction, and the holding claw 7 is caused to enter between the lower surface Wb of the plate workpiece W and the holding surface of the holding table 9 to hold the workpiece W.SELECTED DRAWING: Figure 7
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Inventors:
YAMADA TOMOHIRO
Application Number:
JP2018012474A
Publication Date:
August 08, 2019
Filing Date:
January 29, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/677; B24B41/06; B65G49/07
Domestic Patent References:
| JP2014110364A | 2014-06-12 | |||
| JP2014093513A | 2014-05-19 | |||
| JP2009166955A | 2009-07-30 | |||
| JP2013219328A | 2013-10-24 | |||
| JP2014060346A | 2014-04-03 | |||
| JP2017034015A | 2017-02-09 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office