Title:
TREATING METHOD OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3400514
Kind Code:
B2
Abstract:
PURPOSE: To enhance an inner circuit board used for manufacturing a multilayered printed board and insulating adhesive resin in adhesion between them so as to improve the printed board in resistance to soldering heat.
CONSTITUTION: The surface of a copper circuit provided onto a circuit board is subjected to an oxidizing treatment. Then, the surface of the copper circuit is treated with coupling agent, and the coupling agent is baked on the surface of the copper circuit at temperatures higher than 155°C. The copper circuit and prepreg insulating adhesive resin are enhanced in adhesive properties between them through an anchoring effect obtained by roughening the surface of the copper circuit and a coupling effect obtained by coupling agent. Furthermore, a coupling agent film deposited on the surface of the copper wiring can be enhanced in strength, and an increase in adhesion between the copper circuit and prepreg insulating adhesive resin by coupling agent can be promoted by baking carried out at temperatures higher than 155°C.
More Like This:
Inventors:
Akinori Hibino
Takashi Sagara
Tatsuya Watanabe
Takashi Sagara
Tatsuya Watanabe
Application Number:
JP282294A
Publication Date:
April 28, 2003
Filing Date:
January 14, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
H05K3/38; H05K3/46; (IPC1-7): H05K3/38; H05K3/46
Domestic Patent References:
| JP2291196A | ||||
| JP4274389A | ||||
| JP225779B2 | ||||
| JP621473B1 |
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)
Previous Patent: HIGH-FREQUENCY MAGNETIC FIELD WAVEFORM GENERATING METHOD IN MRI SYSTEM
Next Patent: TARGET CATHODE APPARATUS
Next Patent: TARGET CATHODE APPARATUS