Title:
WIRE SAW DEVICE
Document Type and Number:
Japanese Patent JP2007175784
Kind Code:
A
Abstract:
To provide a wire saw device, equally keeping tension applied to a wire on the whole.
This wire saw device includes: a main roller 5 having a number of groove parts 8 formed at predetermined spaces on the surface; and a wire 3 wound round the groove parts 8 to cut a member 1 to be cut, wherein the space between the adjacent wires 3 is set larger at both end parts S.
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Inventors:
KAWAMURA SATOSHI
Application Number:
JP2005373427A
Publication Date:
July 12, 2007
Filing Date:
December 26, 2005
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
B24B27/06; B28D5/04
Domestic Patent References:
JP2000005999A | 2000-01-11 | |||
JPH04135157A | 1992-05-08 | |||
JPH07117043A | 1995-05-09 | |||
JPH11123648A | 1999-05-11 | |||
JPH1044142A | 1998-02-17 | |||
JPH11123649A | 1999-05-11 | |||
JPH09290417A | 1997-11-11 | |||
JP2005014157A | 2005-01-20 |