Title:
APPARATUS FOR WAFER SURFACE TREATMENT
Document Type and Number:
Japanese Patent JP3126859
Kind Code:
B2
Abstract:
PURPOSE: To provide a space-saving wafer surface treatment system, in which rinsed wafers are kept out of dust particles or gas until they are completely dray, so as to improve system throughput and yield.
CONSTITUTION: An integrated dryer-cleaner tank 10 comprises a cleaning tank 12 confined enclosure chamber 16. Wafers W washed in the cleaning tank are rinsed with pure wafer, and they are dried in the enclosure chamber 16, which contains vaporized organic solvent at reduced pressure.
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Inventors:
Masato Tanaka
Kazunori Fujikawa
Yuusuke Muraoka
Kazunori Fujikawa
Yuusuke Muraoka
Application Number:
JP29476693A
Publication Date:
January 22, 2001
Filing Date:
October 29, 1993
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/677; H01L21/304; H01L21/68; (IPC1-7): H01L21/304; H01L21/304
Domestic Patent References:
| JP515858A | ||||
| JP480924A | ||||
| JP1226157A | ||||
| JP4251930A | ||||
| JP5275412A | ||||
| JP330330A | ||||
| JP5190526A | ||||
| JP6196470A | ||||
| JP426123A | ||||
| JP59128733U | ||||
| JP5508737A |