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Title:
SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH HEAD AND HARD DISK DRIVE
Document Type and Number:
Japanese Patent JP2017102994
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for a suspension capable of hindering molten solder from making contact with a cover layer to prevent a damage to the cover layer and to secure electrical joint reliability with a magnetic head slider or an external circuit, and also to provide a suspension, a suspension with a head, and a hard disk drive.SOLUTION: A substrate for a suspension includes an interconnect line having a line width narrower than the width of a terminal part and equal to or wider than the line width of electric wiring, between the electric wiring and the terminal part. The length of the interconnect line exposed from the cover layer is longer than the distance between the cover layer and the terminal part. The interconnect line is arranged to extend in an oblique direction different from the extending direction of the electric wiring so as to connect to the terminal part.SELECTED DRAWING: Figure 5

Inventors:
ADACHI TAKASHI
MIURA YOICHI
NAGAI YOICHI
Application Number:
JP2017031492A
Publication Date:
June 08, 2017
Filing Date:
February 22, 2017
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G11B5/60; G11B21/21; H05K3/28; H05K3/34
Domestic Patent References:
JP2011175706A2011-09-08
JP2003308668A2003-10-31
JPH10178248A1998-06-30
JPS61121778U1986-07-31
Attorney, Agent or Firm:
Hiromi Fujimasu
Keiko Fukamachi
Hideo Ito
Naoki Goto
Yusuke Ito
Hideyuki Tateishi