Title:
WAFER LAMINATE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2017220669
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer laminate suitable for thin wafer fabrication and capable of improving productivity of a thin wafer, by facilitating the bonding of a support and a wafer, and peeling of the wafer from the support, and to provide a manufacturing method thereof.SOLUTION: In a wafer laminate including a support, an adhesive layer formed on the support, and a wafer laminated so that the surface having a circuit surface faces the adhesive layer, the adhesive layer includes, in order from the support side, a resin layer A having a light shielding property, a resin layer B containing a resin containing a siloxane skeleton and an epoxy group, and a resin layer C containing a non-silicon thermoplastic resin. The resin layer B is composed of a hardened resin composition B containing a resin containing a siloxane skeleton and an epoxy group, and the resin modulus of the hardened resin composition B is 10-1,000 MPa.SELECTED DRAWING: Figure 1
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Inventors:
YASUDA HIROYUKI
SUGAO MICHIHIRO
SUGAO MICHIHIRO
Application Number:
JP2017108863A
Publication Date:
December 14, 2017
Filing Date:
June 01, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
H01L21/304; B24B7/22; C09J7/35; C09J163/00; C09J183/04; C09J201/00; H01L21/683
Domestic Patent References:
| JP2015179692A | 2015-10-08 | |||
| JP2004064040A | 2004-02-26 | |||
| JP2009543708A | 2009-12-10 | |||
| JP2013171949A | 2013-09-02 |
Foreign References:
| WO2015115060A1 | 2015-08-06 | |||
| US20160133486A1 | 2016-05-12 |
Attorney, Agent or Firm:
Hideaki International Patent Office