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Title:
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/022094
Kind Code:
A1
Abstract:
A curable adhesive composition for use in bonding wiring members as a component of a multilayered wiring board. The curable adhesive composition gives a cured object which, when the thermal expansion coefficient and glass transition temperature thereof are expressed by CTE0 (ppm/°C) and Tg0 (°C), respectively, satisfies both the following requirements (A) and (B). Requirement (A): 5≤CTE0≤270 Requirement (B): 140≤Tg0≤280

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Inventors:
OHKOSHI MASASHI (JP)
TAKANO NOZOMU (JP)
AKAI KUNIHIKO (JP)
IZAWA HIROYUKI (JP)
ITOH YUKA (JP)
TAKAGI SHUNSUKE (JP)
Application Number:
PCT/JP2022/030638
Publication Date:
February 23, 2023
Filing Date:
August 10, 2022
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H05K3/40; C09J7/35; C09J9/02; C09J11/04; C09J201/00; H05K1/11; H05K1/14; H05K3/36; H05K3/46
Foreign References:
JP2011195748A2011-10-06
JP2011225740A2011-11-10
JP2012052044A2012-03-15
JPH08330356A1996-12-13
JP2014216599A2014-11-17
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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