Title:
ELECTRICAL CIRCUIT BODY, POWER CONVERSION DEVICE, AND ELECTRICAL CIRCUIT BODY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/123870
Kind Code:
A1
Abstract:
This electrical circuit body comprises: a power semiconductor element joined to one surface of a conductor plate; a sheet member including an insulating layer joined to the other surface of the conductor plate; a sealing member that integrally seals the sheet member, the conductor plate, and the power semiconductor element in a state in which the surface of the sheet member opposite to the surface to be joined to the conductor plate is exposed; and a cooling member bonded to the opposite surface of the sheet member with a heat conductive member interposed therebetween. On the surface of the sealing member to which the sheet member is exposed, a recess is formed along the outer edge of the sheet member, farther on the outer peripheral side than the sheet member.
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Inventors:
TANG NING (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
IDE EIICHI (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
IDE EIICHI (JP)
Application Number:
PCT/JP2021/036023
Publication Date:
June 16, 2022
Filing Date:
September 29, 2021
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/28; H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| WO2018159209A1 | 2018-09-07 |
Foreign References:
| JP2013258334A | 2013-12-26 | |||
| JP2012033872A | 2012-02-16 | |||
| JP2013073964A | 2013-04-22 | |||
| JP2020088019A | 2020-06-04 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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