ELECTROLESS PLATING UNDERCOAT AGENT CONTAINING POLYMER AND METALLIC MICROPARTICLES

Title:

ELECTROLESS PLATING UNDERCOAT AGENT CONTAINING POLYMER AND METALLIC MICROPARTICLES

Document Type and Number:

WIPO Patent Application WO/2020/129649

Kind Code:

A1

Abstract:

[Problem] To provide an electroless plating undercoat agent containing a polymer and metallic microparticles. [Solution] Provided is an electroless plating undercoat agent for forming a metal plating film on a substrate by electroless plating, said agent containing: (A)a copolymer containing a structural unit derived from a monomer a, which has, in a molecule, a metal dispersive group and one radical-polymerizable double bond, and a structural unit derived from a monomer b which has, in a molecule, a crosslinkable group and one radical-polymerizable double bond; (B) metallic microparticles; and (c) a solvent.

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Inventors:

HOSHINO YUKI (JP)
MORIMOTO YUDAI (JP)

Application Number:

PCT/JP2019/047444

Publication Date:

June 25, 2020

Filing Date:

December 04, 2019

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Assignee:

NISSAN CHEMICAL CORP (JP)

International Classes:

C23C18/18

Domestic Patent References:

WO2017142022A1	2017-08-24
WO2014142008A1	2014-09-18
WO2019171985A1	2019-09-12

Foreign References:

JPS5819335A

1983-02-04

Attorney, Agent or Firm:

HANABUSA PATENT & TRADEMARK OFFICE (JP)

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