FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WIPO Patent Application WO/2011/004659

A1

A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer, supports the semiconductor wafer when the semiconductor wafer is cut and separated by dicing, and is structured so as to be selectively peeled off at the interface between the first adhesive layer and the bonding layer when a die is picked up. The film for a semiconductor is characterized in that when the peel strength of a die at 23 ˚C is denoted by F23 (cN/25mm) and the peel strength of the die at 60 ˚C is denoted by F60 (cN/25mm), the peel strength F23 is 10 to 80 and the ratio F60/F23 is 0.3 to 5.5. This makes it possible to improve the pick-up performance and to prevent problems of a semiconductor device from occurring.

JP2013229462	PROCESSING DEVICE INCLUDING CLEANING MECHANISM
JP5758111	Cutting equipment
JP5236917	Cutting blade detection mechanism of cutting equipment

YASUDA HIROYUKI (JP)
HIRANO TAKASHI (JP)

PCT/JP2010/059190

January 13, 2011

May 31, 2010

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SUMITOMO BAKELITE CO (JP)
YASUDA HIROYUKI (JP)
HIRANO TAKASHI (JP)

H01L21/301; C09J7/20; C09J133/00; C09J161/06; C09J163/00; H01L21/52

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ASAHI Kazuo et al. (JP)
Morning ratio One husband (JP)

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