Title:
METAL PASTE FOR JOINING AND JOINING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/070294
Kind Code:
A1
Abstract:
Provided is a paste for joining with which the occurrence of voids, even for a large joining surface area, is reduced at edges thereof and with which a uniform joining layer can be formed. Also provided is a joining method using the paste. The present invention provides a metal paste for joining containing metal nanoparticles (A), the primary particle diameters of which have a number mean value of 10 to 100 nm. When 100 is assigned to the cumulative value (L700) for the loss in mass of the paste upon raising the temperature from 40 °C to 700 °C at a heating rate of 3 °C/minute in a nitrogen atmosphere, the cumulative value (L100) for the loss in mass upon raising the temperature from 40 °C to 100 °C is 75 or less, the cumulative value (L150) for the loss in mass upon raising the temperature from 40°C to 150°C is 90 or greater, and the cumulative value (L200) for the loss in mass upon raising the temperature from 40 °C to 200 °C is 98 or greater.
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Inventors:
ENDOH KEIICHI (JP)
UEYAMA TOSHIHIKO (JP)
UEYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2020/037105
Publication Date:
April 07, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; H01L21/52
Foreign References:
| JP5976684B2 | 2016-08-24 | |||
| JP2010053449A | 2010-03-11 |
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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