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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING COPPER WIRE MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/168054
Kind Code:
A1
Abstract:
This method for manufacturing a copper wire member comprises: a step in which a wire member (1) that comprises copper or a copper alloy is prepared, the wire member (1) having a cross-section (1A) that is perpendicular to the lengthwise direction (L) and a first flat surface (1B) that is parallel to the lengthwise direction (L); and a step in which, as the wire member (1) is advanced in a direction (D2) that follows the lengthwise direction (L), first ultrasonic waves (42a) are transmitted towards the first flat surface (1B), first reflected waves that are first ultrasonic waves (42a) that have been reflected by the wire member (1) are received, and internal defects in the wire member (1) are detected on the basis of the first reflected waves. It is possible, thereby, to adequately detect fine defects inside the copper wire member, thus allowing a copper wire member of consistent quality to be manufactured.

Inventors:
HATANAKA YUJI (JP)
TSUJIBAYASHI TARO (JP)
SHIBUTANI KYOUSUKE (JP)
Application Number:
PCT/JP2017/038843
Publication Date:
September 20, 2018
Filing Date:
October 27, 2017
Export Citation:
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Assignee:
SUMITOMO ELECTRIC WINTEC INC (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
G01N29/04; G01N29/27; H01B13/00
Foreign References:
JPH0455756A1992-02-24
JP2015028903A2015-02-12
JPH07306187A1995-11-21
JPS61278755A1986-12-09
JP2002022715A2002-01-23
JP2000230926A2000-08-22
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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