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Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING PROBE SUBSTRATE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2011/081129
Kind Code:
A1
Abstract:
Provided are a method for manufacturing a printed circuit substrate and a method for manufacturing a probe substrate using the same which comprise: a first manufacturing process for manufacturing a first substrate unit (4) in which a planar first insulation base material (1) is formed from thermoplastic resin and a first transmission line (2) is formed by using a transfer method so as to be flush with a first surface (3) of the first insulation base material (1); a second manufacturing process for manufacturing a second substrate unit (8) in which a planar second insulation base material (5) is formed from thermoplastic resin and a second transmission line (6) is formed by using a transfer method so as to be flush with a first surface (7) of the second insulation base material (5); and a wiring connection process in which the first and second substrate units (4,8) are stacked and thermocompression bonded at the first surfaces (3,7) of the insulation base materials (1,5) and the first transmission line (2) and the second transmission line (6) are brought into direct contact and electrically connected.

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Inventors:
WADA TATSUO (JP)
SHIBATA KOHEI (JP)
AOYAGI MASAHIRO (JP)
KIKUCHI KATSUYA (JP)
NAKAGAWA HIROSHI (JP)
Application Number:
PCT/JP2010/073529
Publication Date:
July 07, 2011
Filing Date:
December 27, 2010
Export Citation:
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Assignee:
MEIKO ELECTRONICS CO LTD (JP)
NAT INST OF ADVANCED IND SCIEN (JP)
WADA TATSUO (JP)
SHIBATA KOHEI (JP)
AOYAGI MASAHIRO (JP)
KIKUCHI KATSUYA (JP)
NAKAGAWA HIROSHI (JP)
International Classes:
H05K3/46; G01R1/073; H05K3/20; H05K3/40
Foreign References:
JP2004343055A2004-12-02
JPH06152138A1994-05-31
JP2005012135A2005-01-13
JPH09330995A1997-12-22
JPS6365638A1988-03-24
JPS63152141A1988-06-24
Attorney, Agent or Firm:
NAGATO, KANJI (JP)
Nagato δΎƒ 2 (JP)
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