Title:
METHOD FOR PRODUCING MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/181260
Kind Code:
A1
Abstract:
In this method for producing a multilayer ceramic electronic component, a base multilayer body is cut at predetermined intervals, a plurality of first rod-like bodies extending in a first direction are formed, a resin is arranged between at least one surface of each of the first rod-like bodies and the first rod-like bodies adjacent thereto, a flat plate-like block in which the plurality of first rod-like bodies are fixed to each other is formed, the flat plate-like block is cut at predetermined intervals in a second direction orthogonal to the first direction, a plurality of second rod-like bodies in which a plurality of element precursors are disposed in a row are thereby formed, the cut surfaces of each of the second rod-like bodies are machined, the plurality of element precursors serve as a plurality of element components, the plurality of element components are fired, the plurality of element components are sintered, and the resin is removed therefrom.
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Inventors:
SATO HISASHI (JP)
Application Number:
PCT/JP2022/003843
Publication Date:
September 01, 2022
Filing Date:
February 01, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01G4/30
Foreign References:
| JP2019009266A | 2019-01-17 | |||
| JPS61219124A | 1986-09-29 | |||
| JP2006128285A | 2006-05-18 | |||
| JP2013026257A | 2013-02-04 |
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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