Title:
MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2020/066490
Kind Code:
A1
Abstract:
A multilayer body (10) according to the present invention is provided with: a first electronic component (100); a structure (150) which has a first region (R1) and a second region (R2) in a plan view, with the first electronic component (100) being arranged in the second region (R2); and a second electronic component (200) which is bump-mounted on the structure (150), with a connection pad (180) being interposed therebetween. In the height direction of the structure (150), the surface of the first region (R1) and the surface of the second region (R2) have a height difference (H1). The connection pad (180) is formed on the surface of the first region (R1), the surface of the second region (R2) and a height difference surface (B1) that is composed of the height difference (H1).
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Inventors:
IWAMOTO TAKASHI (JP)
Application Number:
PCT/JP2019/034548
Publication Date:
April 02, 2020
Filing Date:
September 03, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L21/60
Domestic Patent References:
| WO2018116799A1 | 2018-06-28 | |||
| WO2018096830A1 | 2018-05-31 | |||
| WO2013168223A1 | 2013-11-14 |
Foreign References:
| JP2009099637A | 2009-05-07 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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