Title:
PARALLEL STABILIZER FOR PLANE LAPPING AND POLISHING MACHINES AND ROTARY CARRIER SYSTEM FOR DUPLEX HEAD PLANE GRINDING MACHINE,DOUBLE PLANE FINE GLIDING MACHINE,DOUBLE LAPPING MACHINE AND POLISHING MACHINE
Document Type and Number:
WIPO Patent Application WO/1982/003040
Kind Code:
A1
Abstract:
Conventional lapping and polishing operations in which parallelism and dimensional accuracy are almost impossible to control are improved. The parallelism and dimensional accuracy are obtained by providing a parallelism adjusting unit (4) which incorporates a long hole (7) opened in a surface plate (3) and which is displaced in response to a work (10). A rotating workpiece (12) is passed between two grindstones or between lapping and polishing machines (11). It incorporates a tension screw (17), a tension fitment (16) and a tension flange (15). Since tension is applied to a carrier (12) in a complete profile in an outer peripheral direction by the tension screw (17), and the carrier (12) is rectilinearly spanned, and extremely thin carrier (12) can be used, and can accordingly both side surfaces of an extremely thin workpiece can be machined simultaneously.
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| JP2002221163 | VANE GRINDING DEVICE FOR VANE PUMP |
| JP2004071833 | METHOD FOR POLISHING BOTH SIDES OF SEMICONDUCTOR WAFER |
Inventors:
HATANO KOUICHI (JP)
Application Number:
PCT/JP1981/000052
Publication Date:
September 16, 1982
Filing Date:
March 10, 1981
Export Citation:
Assignee:
SHIBAYAMA KIKAI CO LTD (JP)
ISHIMURA YOSHIO (JP)
HATANO KOUICHI (JP)
ISHIMURA YOSHIO (JP)
HATANO KOUICHI (JP)
International Classes:
B24B7/17; B24B37/10; (IPC1-7): B24B41/06
Foreign References:
| SU637241A2 | 1978-12-15 | |||
| JPS5565069A | 1980-05-16 | |||
| US3791079A | 1974-02-12 | |||
| JPS5558964A | 1980-05-02 | |||
| JPS4839034Y1 | 1973-11-17 |
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