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Patent Searching and Data


Title:
PATTERN MEASURING APPARATUS AND COMPUTER PROGRAM
Document Type and Number:
WIPO Patent Application WO/2011/077644
Kind Code:
A1
Abstract:
Disclosed is a pattern measuring apparatus which can identify the kind of a gap formed in a manufacture process having a plurality of exposure steps, such as SADP, with high accuracy and high throughput. Specifically disclosed is a pattern measuring apparatus which can suitably assess a gap even if a sample has the gap that is not easily assessed. A feature quantity relating to one end side of a pattern having a plurality of patterns disposed therein, and a plurality of kinds of feature quantities relating to the other end side of the pattern are extracted from signals detected on the basis of charged particle beam scanning. With respect to suitable kinds of feature quantities among the plurality of kinds of the feature quantities, the feature quantity on the one end side of the pattern and that on the other end side of the pattern are compared with each other. On the basis of the comparison, the kinds of the spaces among the patterns are determined.

Inventors:
SAKAI KEI (JP)
ZHANG YAFENG (JP)
HASEGAWA NORIO (JP)
Application Number:
PCT/JP2010/006997
Publication Date:
June 30, 2011
Filing Date:
December 01, 2010
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
SAKAI KEI (JP)
ZHANG YAFENG (JP)
HASEGAWA NORIO (JP)
International Classes:
G01B15/04; H01L21/027; H01L21/66
Domestic Patent References:
WO2010119641A12010-10-21
Foreign References:
JP2009141124A2009-06-25
JP2008118033A2008-05-22
JP2001147113A2001-05-29
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
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