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Patent Searching and Data


Title:
PATTERN MEASURING APPARATUS AND PATTERN MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/052070
Kind Code:
A1
Abstract:
Provided are pattern measuring apparatus and a pattern measuring method by which influences of SEM image noise and edge roughness are reduced and the corner shape of a pattern can be highly accurately measured. The pattern measuring apparatus has: an irradiating means which irradiates a sample with an electron beam; an electron detecting means which detects, by means of electron beam irradiation, the quantity of the electrons generated from the sample having the pattern formed thereon; an image processing means which generates an SEM image of the pattern based on the electron quantity; and a control means, which obtains a rectangular measurement specifying region which specifies a portion to be measured in the SEM image, and calculates the loss ratio of the corner section of the pattern, based on the area of the measurement specifying region and that of the corner section of the pattern. The control means detects an edge position within a predetermined range with respect to the position where an angle of the measurement specifying region and the side of the SEM image intersect, and adjusts the measurement specifying region corresponding to the edge position.

Inventors:
FUKAYA HIROSHI (JP)
MATSUMOTO JUN (JP)
Application Number:
PCT/JP2009/068681
Publication Date:
May 05, 2011
Filing Date:
October 30, 2009
Export Citation:
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Assignee:
ADVANTEST CORP (JP)
FUKAYA HIROSHI (JP)
MATSUMOTO JUN (JP)
International Classes:
G01B15/04; G01N23/225; H01J37/22; H01J37/28; H01L21/027; H01L21/66
Domestic Patent References:
WO2008032488A12008-03-20
Foreign References:
JP2002296761A2002-10-09
JP2004125690A2004-04-22
JP2002162216A2002-06-07
JP2001183116A2001-07-06
JPH10339615A1998-12-22
Attorney, Agent or Firm:
OKAMOTO, KEIZO (JP)
Keizo Okamoto (JP)
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