PLATING APPARATUS AND PLATING METHOD

Title:

PLATING APPARATUS AND PLATING METHOD

Document Type and Number:

WIPO Patent Application WO/2007/086510

Kind Code:

A1

Abstract:

[PROBLEMS] To propose a plating apparatus in which the plating metal hardly deposited on the cathode feed roller even if the cathode feed roller is disposed in the plating bath. [MEANS FOR SOLVING PROBLEMS] Current is supplied to the plating forming surface of a film (30A) through a feed roller (52) and an auxiliary feed roller (54) electrically interconnected through a short-circuit wire (84). Even if the insulating tape of the film joint comes into contact with either the feed roller (52) or the auxiliary feed roller (54) and the current supply is stopped, or even if the film (30A) separates from either the feed roller (52) or the auxiliary feed roller (54) because of slack and the current supply is stopped, the other feed roller, i.e., the auxiliary feed roller (54) or the feed roller (52), is always in contact with the plating surface of the film (30A) and current is supplied. Therefore, no electroplating film does not deposit on both surfaces of the feed roller (52) and the auxiliary feed roller (54).

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Inventors:

TACHI YASUAKI (JP)
SAWA SHIGEKI (JP)
KASUGA TOSHIYUKI (JP)

Application Number:

PCT/JP2007/051275

Publication Date:

August 02, 2007

Filing Date:

January 26, 2007

Export Citation:

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Assignee:

IBIDEN CO LTD (JP)
TACHI YASUAKI (JP)
SAWA SHIGEKI (JP)
KASUGA TOSHIYUKI (JP)

International Classes:

C25D7/06; C25D17/10; H05K3/42

Foreign References:

JPS63270497A	1988-11-08
JP2005113173A	2005-04-28
JPH08144086A	1996-06-04
JPH05230691A	1993-09-07
JPS5757896A	1982-04-07

Attorney, Agent or Firm:

TASHITA, Akihito (Sakae 1-chome Naka-k, Nagoya-shi Aichi, JP)

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