POLISHING MATERIAL AND POLISHING MATERIAL MANUFACTURING METHOD

WIPO Patent Application WO/2016/203914

A1

The purpose of the present invention is to provide a polishing material with excellent polishing rate and planarization precision and which is not susceptible to reduction in polishing rate over relatively long periods. The present invention is a polishing material provided with a base material, a polishing layer laminated on the front surface of said base material and comprising abrasive grains and a binder therefor, and an adhesive layer laminated on the back surface of said base material. The polishing material is characterized in that: the abrasive grains are diamond abrasive grains; the amount of wear of said polishing layer by the Taber abrasion test is 0.03 g to 0.18 g; and the Asker D hardness measured from the front surface of the polishing layer is 80° to 98°. Preferably, the main component of said binder is an inorganic substance. The binder preferably contains a filler with an inorganic oxide as the main component. Said polishing layer preferably has multiple grooves on the surface. Said polishing layer is preferably formed by a printing method.

JPS6268277	ABRASIVE MATERIAL AND MANUFACTURE THEREOF
JP2022029218	THERMOSETTING ADHESIVE FILM, METHOD FOR PRODUCING GRINDING WHEEL, AND GRINDING WHEEL
JP2004306257	CHEMICAL MECHANICAL POLISHING CONDITIONER

SAITO KAZUO (JP)
SHIMOYAMA KENJI (JP)
IWANAGA TOMOKI (JP)
TAURA TOSHIKAZU (JP)

PCT/JP2016/065327

December 22, 2016

May 24, 2016

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BANDO CHEMICAL IND (JP)

B24D3/00; B24D3/34; B24D3/04; B24D11/00

WO2013108725A1

2013-07-25

JP2010188522A	2010-09-02
JP2015100895A	2015-06-04

AMANO KAZUNORI (JP)
Kazuki Amano (JP)

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