PRESSURE SENSOR AND PRODUCTION METHOD THEREOF

WIPO Patent Application WO/2007/004400

A1

To improve work efficiency and realize a low-cost structure without electrically damaging the electronic components of a pressure sensor. Contact pins (27-1 to 3) connected via a binding wire material to a pressure detecting sensor chip are mounted to a resin body (12). The ends of electric wires (50-1 to 3) connected with an external apparatus are semi-stripped and simultaneously ultrasonic-welded to three contact pins (27-1 to 3) using an ultrasonic-welding machine. Partition plates (34) are provided between the contact pins to prevent short-circuiting between electric wires. Each contact pin (27-1 to 3) is provided with a hole (38) for reducing its rigidity to prevent the connection of spot-welded contact pins and a binding wire material from being disconnected at ultrasonic-welding. After the electric wires (50-1 to 3) and the contact pins (27-1 to 3) are ultrasonic-welded, a resin case (40) is placed over the resin body (12) to allow a sealant (42) to poured in.

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SUZUKI KAZUSHIGE (JP)
WATANABE HAJIME (JP)

PCT/JP2006/312006

January 11, 2007

June 15, 2006

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SAGINOMIYA SEISAKUSHO INC (JP)
SUZUKI KAZUSHIGE (JP)
WATANABE HAJIME (JP)

G01L19/14

JP2001141588A	2001-05-25
JPH0118037A
JPH09218123A	1997-08-19
JPS62202779U	1987-12-24
JPS5596584A	1980-07-22
JP2003338349A	2003-11-28
JP2004163321A	2004-06-10
JPH09199196A	1997-07-31
JPH0615467A	1994-01-25

TAKAHASHI, Hideo et al. (Shinkawa-Ohara BLDG. 6F 27-8 Shinkawa 1-chom, Chuo-ku Tokyo 33, JP)

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