Title:
RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SOLDER RESIST, DRY FILM, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/006164
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a composition capable of producing a cured product that improves the peel strength while maintaining heat resistance, also achieves lowering of the elastic modulus, or enables both heat resistance and lowering of the elastic modulus, and has excellent copper foil adhesiveness. This resin composition includes a resin and modified resin, and is characterized in that the resin contains a thermosetting resin or a combination of an acid group-containing epoxy (meth)acrylate resin and a curing agent and the modified resin contains a polyurethane resin having an isocyanate group.
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Inventors:
MATSUMURA YUUSUKE (JP)
NAKAMURA AKIFUMI (JP)
NAKAMURA AKIFUMI (JP)
Application Number:
PCT/JP2020/025946
Publication Date:
January 14, 2021
Filing Date:
July 02, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/42; C08G18/10; C08G18/40; C08G18/42; C08G18/48; C08G18/58; C08J5/24; C08L75/04; C08L101/00; G03F7/004; G03F7/027; H05K1/03; H05K3/28
Foreign References:
| JP2017082128A | 2017-05-18 | |||
| JP2006104277A | 2006-04-20 | |||
| JPH0820706A | 1996-01-23 | |||
| JP2003504893A | 2003-02-04 | |||
| JP2003246828A | 2003-09-05 | |||
| KR100652830B1 | 2006-12-01 | |||
| JP2004175967A | 2004-06-24 | |||
| JP2002305212A | 2002-10-18 | |||
| JPH10273580A | 1998-10-13 | |||
| JPH08104732A | 1996-04-23 | |||
| JPH05182176A | 1993-07-23 | |||
| JP2019070121A | 2019-05-09 | |||
| JP2013108068A | 2013-06-06 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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