Title:
SEMICONDUCTOR DEVICE CARRIER, MANUFACTURING METHOD THEREFOR, AND DEVICE HANDLER INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2017/196109
Kind Code:
A1
Abstract:
The present invention relates to an EMI shield process and, more specifically, to an EMI shield process for forming EMI shield layers on an upper surface and a lateral surface of a semiconductor device having a plurality of protruding terminals formed on a lower surface thereof. Disclosed is a semiconductor device carrier to which a plurality of semiconductor devices is attached in order to perform an EMI shield layer (13) formation process for forming EMI shield layers (13) on an upper surface and a lateral surface of a semiconductor device having a plurality of protruding terminals (12) formed on a lower surface thereof, the carrier comprising: a plate-shaped base member (100) having a preset rigidity and having a plurality of first through-holes (101) formed in a size corresponding to terminal areas in which the protruding terminals (12) of the respective semiconductor devices are formed; and an attachment layer (200) formed on an upper surface of the base member (100) such that the terminal areas are exposed to the lower side of the first through-holes (101) and edges of the terminal areas can be attached to the base member (100).
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Inventors:
YOU HONG JUN (KR)
Application Number:
PCT/KR2017/004898
Publication Date:
November 16, 2017
Filing Date:
May 11, 2017
Export Citation:
Assignee:
JT CORP (KR)
International Classes:
H01L21/673; H01L21/52; H01L21/67; H01L23/60
Foreign References:
| KR101604582B1 | 2016-03-17 | |||
| KR101501735B1 | 2015-03-12 | |||
| KR100748482B1 | 2007-08-10 | |||
| KR20110002496A | 2011-01-07 | |||
| JP2003040389A | 2003-02-13 |
Attorney, Agent or Firm:
B&IP-JOOWON PATENT AND LAW FIRM (KR)
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