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Title:
SEMICONDUCTOR LIGHT-EMITTING ELEMENT CHIP INTEGRATION DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/059280
Kind Code:
A1
Abstract:
This semiconductor light-emitting element chip integration device comprises: a mounting substrate 100 having a lower electrode 120 on one main surface thereof; a chip coupling portion including a part of an upper surface of the lower electrode 120; a vertical semiconductor light-emitting element chip 10 coupled with the chip coupling portion and having a plurality of p-side electrodes 17 and one n-side electrode vertically; and an upper electrode 140 disposed in a layer over the chip and comprising an upper electrode trunk line portion 141 interconnected with a plurality of upper electrode branch-line portions 142 by a thin-film fuse 143. The semiconductor light-emitting element chip 10 is coupled with the n-side electrode facing the chip coupling portion. The n-side electrode and the lower electrode 120 are electrically connected to each other. At least one p-side electrode 17 and the upper electrode branch-line portions 142 of the upper electrode 140 are electrically connected to each other.

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Inventors:
TAKEYA MOTONOBU (JP)
Application Number:
PCT/JP2021/022603
Publication Date:
March 24, 2022
Filing Date:
June 15, 2021
Export Citation:
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Assignee:
ULDTEC CO LTD (JP)
International Classes:
H01L33/62; G09F9/33; H01L33/00; H01L33/38
Domestic Patent References:
WO2018038105A12018-03-01
WO2015015915A12015-02-05
WO2021084783A12021-05-06
Foreign References:
JP6694222B12020-05-13
JP2020025064A2020-02-13
US20190371777A12019-12-05
JP2018174185A2018-11-08
CN108336191A2018-07-27
US20160125804A12016-05-05
KR20150035112A2015-04-06
JP2014132655A2014-07-17
JP2013004792A2013-01-07
JP2012195406A2012-10-11
JP2010087453A2010-04-15
JPH11224960A1999-08-17
JP6886213B12021-06-16
Attorney, Agent or Firm:
MORI Koh-ichi (JP)
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