SEMICONDUCTOR PROCESS CHAMBER, SEMICONDUCTOR PROCESS APPARATUS, AND SEMICONDUCTOR PROCESS METHOD

WIPO Patent Application WO/2023/030214

A1

Provided are a semiconductor process chamber, a semiconductor process apparatus, and a semiconductor process method. The chamber comprises a reaction chamber (100) and a transfer chamber (200) located below the reaction chamber (100), wherein the reaction chamber (100) is in communication with the transfer chamber (200) through a bottom opening; a base (300) is arranged in the semiconductor process chamber; a lifting shaft (520) is connected to the bottom of the base (300), so as to move up and down between the reaction chamber (100) and the transfer chamber (200) through the bottom opening; an elastic annular sealing structure (400) is arranged below the base (300) and around the lifting shaft (520) of the base (300); during the base (300) descending to the transfer chamber (200), the base (300) can press down the annular sealing structure (400), such that the annular sealing structure is compressed; and when the base (300) rises to the reaction chamber (100), and pressure applied to the annular sealing structure (400) is relieved, the annular sealing structure (400) elongates under the action of its own elastic force until the annular sealing structure abuts against a bottom wall of the reaction chamber (100), so as to seal the bottom opening. The pressure control effect of the reaction chamber (100) is improved, a process effect is improved, a wafer transfer time is shortened, and the film forming efficiency of a semiconductor process is increased.

JP2016510946	Equipment and methods for controlling the clearance from the injector to the substrate
JP2013500595	Cleaning the process chamber
WO/2017/199570	CLEANING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND PROGRAM

WANG YONGFEI (CN)
SHE QING (CN)
LAN YUNFENG (CN)

PCT/CN2022/115371

March 09, 2023

August 29, 2022

Click for automatic bibliography generation  

BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)

C23C16/44

CN113718229A	2021-11-30
CN105734520A	2016-07-06
CN106206399A	2016-12-07
JP2006066457A	2006-03-09
CN104103549A	2014-10-15
CN111501000A	2020-08-07
CN110911338A	2020-03-24

TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)

View/Download PDF      PDF Help

Previous Patent: PRESTRESSED CONCRETE SUPPORT PILE AND PRODUCTION METHOD THEREFOR

Next Patent: PYRIDOPYRIMIDONE DERIVATIVE, AND PREPARATION METHOD THEREFOR AND USE THEREOF