Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE INSPECTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/169179
Kind Code:
A1
Abstract:
Provided is a substrate inspection apparatus whereby an electrical characteristic of a semiconductor device packaged in a mounting environment can be inspected. A prober 10 is provided with a test box 14, a probe card 15, and a package inspection card 26, a packaged device 30 is attached to the package inspection card 26, and a test board 22 of the text box 14 and a card board 27 of the package inspection card 26 reproduce a mounting environment in which wafer-level and system-level testing is performed.

More Like This:
JPH02290039MEASURING METHOD FOR SEMICONDUCTOR DEVICE
JP4566369Non-volatile semiconductor memory device
JP2006153529APPARATUS FOR MUTUAL CONNECTION, AND ELEMENT FOR CONTACT THEREFOR
Inventors:
MURATA MICHIO (JP)
KAWASHIMA TATSUO (JP)
Application Number:
PCT/JP2017/005031
Publication Date:
October 05, 2017
Filing Date:
February 07, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G01R31/28; H01L21/66
Foreign References:
JP2000121704A2000-04-28
JP2002214294A2002-07-31
JP2000208567A2000-07-28
Other References:
See also references of EP 3438679A4
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: IRON-BASED SOFT MAGNETIC MATERIAL, METHOD FOR PRODUCING IRON-BASED SOFT MAGNETIC MATERIAL, AND IRON-...

Next Patent: VEHICLE DRIVE DEVICE AND ELECTRIC VEHICLE