SUBSTRATE MOUNTING TABLE AND PLASMA TREATMENT DEVICE

Title:

SUBSTRATE MOUNTING TABLE AND PLASMA TREATMENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/108750

Kind Code:

A1

Abstract:

A substrate mounting table (94) is equipped with a mounting table (2), an electrostatic chuck (6), and a bevel covering (5). The electrostatic chuck (6) has a supporting surface (6e) which is in contact with the whole of the rear surface of a wafer (W). The annular bevel covering (5) has an outer diameter (DA) which is greater than that of the supporting surface (6e), and an inner diameter (DI) which is smaller than that of the wafer (W). The bevel covering (5) is disposed such that, when viewed from the direction orthogonal to the supporting surface (6e), the bevel covering (5) surrounds the periphery of the wafer (W) supported on the supporting surface (6e).

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Inventors:

HATOH HIDEYUKI (JP)
DOBA SHIGEKI (JP)
YAMAMOTO SHINYA (JP)
YAMADA SATOSHI (JP)
MORI HIROTO (JP)
ANDO KENJI (JP)

Application Number:

PCT/JP2013/050570

Publication Date:

July 25, 2013

Filing Date:

January 15, 2013

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

H01L21/3065; H01L21/683

Domestic Patent References:

WO2009101979A1

2009-08-20

Foreign References:

JP2007150036A	2007-06-14
JPH09223783A	1997-08-26

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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Claims:

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